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pc357nj0000f series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc357) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. hybrid substrates that require high density mounting 2. programmable controllers applications mini-flat package, general purpose photocoupler 1. 4-pin mini-flat package 2. double transfer mold package (ideal for flow soldering) 3. high collector-emitter voltage (v ceo : 80v) 4. current transfer ratio (ctr) : min. 50% at i f =5ma, v ce =5v 5. several ctr ranks available 6. high isolation voltage between input and output (v iso(rms) : 3.75kv) 7. rohs directive compliant description pc357nj0000f series contains an ired optically coupled to a phototransistor. it is packaged in a 4-pin mini-flat package. input-output isolation voltage(rms) is 3.75kv. collector-emitter voltage is 80v and ctr is 50% to 600% at input current of 5ma. 1 sheet no.: d2-a00102fen date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc357nj0000f series http://
internal connection diagram anode cathode emitter collector 1 1 2 3 4 2 4 3 2 sheet no.: d2-a00102fen outline dimensions (unit : mm) 4 3 1 2 4.4 0.2 5.3 0.3 2.6 0.2 0.1 0.1 3.6 0.3 2.54 0.25 357 0.4 0.1 0.5 +0.4 ? 0.2 7.0 +0.2 ? 0.7 anode mark sharp mark "s" epoxy resin 45? 6? 0.2 0.05 rank mark date code factory identification mark pc357nj0000f series product mass : approx. 0.1g plating material : sncu (cu : typ. 2%) http://
date code (2 digit) rank mark refer to the model line-up table a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark factory identification mark no mark country of origin japan indonesia china * this factory marking is for identification purpose only. please contact the local sharp sales representative to see the actual status of the production 3 repeats in a 20 year cycle sheet no.: d2-a00102fen pc357nj0000f series http://
sheet no.: d2-a00102fen electro-optical characteristics parameter conditions forward voltage reverse current terminal capacitance collector dark current collector-emitter breakdown voltage transfer charac- teristics emitter-collector breakdown voltage collector current collector-emitter saturation voltage isolation resistance floating capacitance min. ? ? ? ? ? 10 10 ? ? ? ? ? ? 10 11 0.6 4 3 max. 1.4 10 250 ? ? ? a pf na ? ? s s symbol v f i r c t i ceo bv ceo bv eco i c v ce (sat) c f t r t f r iso response time rise time fall time input output i f =20ma v r =4v v=0, f=1khz v ce =50v, i f =0 i c =0.1ma, i f =0 i e =10a, i f =0 i f =5ma, v ce =5v i f =20ma, i c =1ma v=0, f=1mhz v ce =2v, i c =2ma, r l =100? =25?c) absolute maximum ratings (t a =25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f =60hz *3 for 10s rating 50 1 70 reverse voltage v v r 6 80 6 50 150 170 ? +100 ? +125 260 3.75 kv 4 pc357nj0000f series http://
sheet no.: d2-a00102fen model line-up model no. with or without a b c d a or b b or c c or d a, b or c b, c or d a, b, c or d i c [ma] (i f =5ma, v ce =5v, t a =25?c) 2.5 to 30.0 4.0 to 8.0 6.5 to 13.0 10.0 to 20.0 15.0 to 30.0 4.0 to 13.0 6.5 to 20.0 10.0 to 30.0 4.0 to 20.0 6.5 to 30.0 4.0 to 30.0 pc357nj0000f pc357n1j000f pc357n2j000f pc357n3j000f pc357n4j000f pc357n5j000f pc357n6j000f pc357n7j000f pc357n8j000f pc357n9j000f pc357n0j000f 3 000pcs/reel taping pc357ntj000f pc357n1tj00f pc357n2tj00f pc357n3tj00f PC357N4TJ00F pc357n5tj00f pc357n6tj00f pc357n7tj00f pc357n8tj00f pc357n9tj00f pc357n0tj00f 750pcs/reel rank mark package 5 please contact a local sharp sales representative to inquire about production status. pc357nj0000f series http://
sheet no.: d2-a00102fen 300 250 200 150 100 50 0 170 05 0 100 25 total power dissipation p tot (mw) ? 3 0 ambient temperature t a (?c) fig.4 total power dissipation vs. ambient temperature forward current i f (ma) forward voltage v f (v) 50?c 25?c 0?c 0 0.5 1 1.5 2 2.5 3 3.5 10 100 1 ? 25?c t a =75?c fig.6 forward current vs. forward voltage duty ratio 10 100 peak forward current i fm (ma) 10 ? 3 10 ? 2 10 ? 1 pulse width 100s t a =25?c 10 000 1 000 1 fig.5 peak forward current vs. duty ratio 0255075 100 125 70 60 50 40 30 20 10 0 forward current i f (ma) ? 30 ambient temperature t a (?c) fig.1 forward current vs. ambient temperature diode power dissipation p (mw) 100 80 120 60 40 20 0 05 0 5 5 100 70 ? 30 ambient temperature t a (?c) fig.2 diode power dissipation vs. ambient temperature 0 0255 075 100 125 200 150 100 50 collector power dissipation p c (mw) ? 3 0 ambient temperature t a (?c) fig.3 collector power dissipation vs. ambient temperature 6 pc357nj0000f series http://
sheet no.: d2-a00102fen collector dark current i ceo (a) ambient temperature t a (?c) 806040200 ? 30 100 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 10 ? 11 v ce =50v fig.11 collector dark current vs. ambient temperature 0.01 0.1 1 10 10 0.1 1 100 response time (s) v ce =2v i c =2ma t a =25?c t s t d t f t r load resistance r l (k?) fig.12 response time vs. load resistance 80 60 0 40 50 100 150 relative current transfer ratio(%) ? 30 020 100 ambient temperature ta (?c) i f =5ma v ce =5v fig.9 relative current transfer ratio vs. ambient temperature 100 200 ? 30 collector-emitter saturation voltage v ce (sat) (v) 0.16 0.1 0.06 40 0 60 80 0.02 0.04 0.08 0.12 0.14 ambient temperature t a (?c) i f =20ma i c =1ma fig.10 collector - emitter saturation voltage vs. ambient temperature 7 50 40 20 10 0 108642 0 30 5ma 10ma 20ma collector current i c (ma) collector-emitter voltage v ce (v) t a =25?c p c (max.) i f =30ma fig.8 collector current vs. collector-emitter voltage 100 10 1 0.1 current transfer ratio ctr (%) 200 400 0 100 300 500 forward current i f (ma) v ce =5v t a =25?c fig.7 current transfer ratio vs. forward current pc357nj0000f series http://
sheet no.: d2-a00102fen remarks : please be aware that all data in the graph are just for reference and not for guarantee. 8 10% 90% output input input please refer to the conditions in fig.12 output r l v cc r d t s t d t r t f v ce fig.13 test circuit for response time 8 12 30 0 collector-emitter saturation voltage v ce (sat) (v) 7 6 5 4 3 2 1 1ma 3ma 5ma 7ma 15 69 forward current i f (ma) i c =0.5ma t a =25?c fig.14 collector-emitter saturation voltage vs. forward current pc357nj0000f series http://
sheet no.: d2-a00102fen design considerations while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 design guide design considerations recommended foot print (reference) 1.5 2.54 0.8 6.3 (unit : mm) pc357nj0000f series http://
sheet no.: d2-a00102fen manufacturing guidelines 10 reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 260?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc357nj0000f series http://
sheet no.: d2-a00102fen pc357nj0000f series solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). presence of odc 11 http://
sheet no.: d2-a00102fen 12 package specification tape and reel package 1. 3 000pcs/reel package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions a 12.0 0.3 b 5.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 7.4 0.1 i 0.3 0.05 j 3.1 0.1 k 4.0 0.1 f 4.0 0.1 g +0.1 ? fe i d j g b a c h 5? max. k h dimensions list (unit : mm) a c e g f b d a 370 b 13.5 1.5 c 80 1.0 d 13 0.5 e 21 1.0 f 2.0 0.5 g 2.0 0.5 dimensions list (unit : mm) pull-out direction [packing : 3 000pcs/reel] reel structure and dimensions direction of product insertion pc357nj0000f series http://
sheet no.: d2-a00102fen 2. 750pcs/reel package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions 13 a 12.0 0.3 b 5.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 7.4 0.1 i 0.3 0.05 j 3.1 0.1 k 4.0 0.1 f 4.0 0.1 g 1.5 +0.1 ? 0 fe i d j g b a c h dimensions list (unit : mm) 5? max. k h a c e g f b d a 180 b 13.5 1.5 c 80 1.0 d 13 0.5 e 21 1.0 f 2.0 0.5 g 2.0 0.5 dimensions list (unit : mm) pull-out direction [packing : 750pcs/reel] reel structure and dimensions direction of product insertion pc357nj0000f series http://
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 14 sheet no.: d2-a00102fen important notices pc357nj0000f series [e182] http://

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